VIETNAM • Bobst and industry partners Coim, Daetwyler SwissTec, Esko, Jindal, Kodak, Macchi and Siegwerk convened at Ho Chi Minh City (Saigon) to meet with decision makers of the local label and packaging industries and present equipment and consumables technology updates and trends.
The presentations of Bobst and partners covered a wide range of topical issues and trends in flexible packaging printing and converting along the value chain from raw materials to finished products.
The ability to satisfy requirements from ultra-short run productions upwards, using a wide range of substrates and web combinations is also a feature of the new range of Bobst compact laminators, the CL 750D multi-technology and the SL 750D solventless machines.
In gravure printing, the focus was on the RS 5002 press and the broad spectrum of great value application requirements met by this machine. In CI flexo printing, the audience was introduced to the advantages of the extended color gamut (ECG) technology and how the 20SEVEN CI flexo press delivers increased efficiency with both conventional and ECG printing.
In the field of substrate functionality the latest updates included the K5 VISION vacuum metallizer and processes for the production of clear barrier films and their conversion and the AluBond process for high adhesion. In coating Bobst presented its new range of CO equipment and solutions for production of high performance substrates, for example lacquered Aluminium foils, barrier films, consumer and industrial tapes and labels.
Last but not least, the company was very glad to present to the audience its new six person strong team of Vietnamese sales and after-sales people, following the official opening of its Bobst Vietnam entity earlier this year.