RadTech Europe – Food packaging seminar

The manufacturing of save food packaging is a main challenge for the package printing industry (Source: The Telegraph)

GERMANY • On 25 October, Radtech Europe will organise a seminar on food packaging at the Moevenpick Airport Hotel, Stuttgart.

The objective of the event is to indicate how print company can benefit from the fast-curing and low-VOC food packaging printing offered by UV/EB and UV-LED in a convenient one-day seminar. It offers a chance to learn about all aspects of UV/EB and UV-LED for food packaging:


  • The latest technological developments
  • The current and expected regulatory requirements
  • The vision of customers and brand-owners
  • Real-life examples of the application of the technology for food packaging products

The food packaging seminar offers a most interesting opportunity to meet authoritative industry experts in materials, inks, printing, equipment and packaging, as well as regulatory affairs for the radiation curing industry. Confirmed companies and organizations speaking include Nestlé, Bobst, OPM, and BASF.

The event is targeted at the entire food packaging value chain, with a special focus on and reduced fee for food packaging converters.

To see the draft program and register for the event, click here.

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